Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing.
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| Title: | Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing. |
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| Authors: | Li, Wangyun1,2,3, Liu, Longgen1, Chen, Feng1, Xu, Yiqin4, Qin, Hongbo1,2, qinhb@guet.edu.cn, Gong, Yubing1,2, gybcome@163.com |
| Source: | Journal of Materials Science: Materials in Electronics; Oct2024, Vol. 35 Issue 30, p1-13, 13p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-024-13692-0 |
