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Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing.

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Title: Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing.
Authors: Li, Wangyun1,2,3, Liu, Longgen1, Chen, Feng1, Xu, Yiqin4, Qin, Hongbo1,2, qinhb@guet.edu.cn, Gong, Yubing1,2, gybcome@163.com
Source: Journal of Materials Science: Materials in Electronics; Oct2024, Vol. 35 Issue 30, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 180645629
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Oct2024, Vol. 35 Issue 30, p1-13, 13p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-13692-0
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      – Code: eng
        Text: English
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        PageCount: 13
        StartPage: 1
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      – TitleFull: Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing.
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            NameFull: Li, Wangyun
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            NameFull: Liu, Longgen
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            NameFull: Chen, Feng
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            NameFull: Xu, Yiqin
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            NameFull: Qin, Hongbo
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            NameFull: Gong, Yubing
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            – D: 21
              M: 10
              Text: Oct2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 30
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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