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Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.

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Bibliographic Details
Title: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
Authors: Shih, Meng-Kai1, mkshih@mail.nsysu.edu.tw, Chen, Shi-Jie2, Lin, I. Hung3, Lou, Bai-Yao3, Ni, Tom3
Source: Journal of Electronic Materials; Dec2024, Vol. 53 Issue 12, p8066-8077, 12p
Database: Applied Science & Technology Source
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ISSN:03615235
DOI:10.1007/s11664-024-11420-2