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Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.

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Title: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
Authors: Shih, Meng-Kai1, mkshih@mail.nsysu.edu.tw, Chen, Shi-Jie2, Lin, I. Hung3, Lou, Bai-Yao3, Ni, Tom3
Source: Journal of Electronic Materials; Dec2024, Vol. 53 Issue 12, p8066-8077, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 180990515
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
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  Data: <searchLink fieldCode="AU" term="%22Shih%2C+Meng-Kai%22">Shih, Meng-Kai</searchLink><relatesTo>1</relatesTo>, <i>mkshih@mail.nsysu.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Chen%2C+Shi-Jie%22">Chen, Shi-Jie</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+I%2E+Hung%22">Lin, I. Hung</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lou%2C+Bai-Yao%22">Lou, Bai-Yao</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Ni%2C+Tom%22">Ni, Tom</searchLink><relatesTo>3</relatesTo>
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        Value: 10.1007/s11664-024-11420-2
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      – Code: eng
        Text: English
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      – TitleFull: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
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              Text: Dec2024
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