Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints.

Saved in:
Bibliographic Details
Title: Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints.
Authors: Plevachuk, Yuriy1,2, yuriy.plevachuk@lnu.edu.ua, Poverzhuk, Viktor2, Švec Sr, Peter1, Švec, Peter1,3, Orovcik, Lubomir4, Bajana, Otto4
Source: Journal of Materials Science: Materials in Electronics; Dec2024, Vol. 35 Issue 34, p1-13, 13p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
Description
ISSN:09574522
DOI:10.1007/s10854-024-13943-0