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Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints.

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Title: Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints.
Authors: Plevachuk, Yuriy1,2, yuriy.plevachuk@lnu.edu.ua, Poverzhuk, Viktor2, Švec Sr, Peter1, Švec, Peter1,3, Orovcik, Lubomir4, Bajana, Otto4
Source: Journal of Materials Science: Materials in Electronics; Dec2024, Vol. 35 Issue 34, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 181536095
AccessLevel: 2
PubType: Academic Journal
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Dec2024, Vol. 35 Issue 34, p1-13, 13p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-13943-0
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      – Code: eng
        Text: English
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        PageCount: 13
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      – TitleFull: Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints.
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            NameFull: Plevachuk, Yuriy
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            NameFull: Poverzhuk, Viktor
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            NameFull: Švec Sr, Peter
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            NameFull: Švec, Peter
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            NameFull: Orovcik, Lubomir
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            – D: 01
              M: 12
              Text: Dec2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 34
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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