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Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.

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Bibliographic Details
Title:	Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.
Authors:	Chen, Xuhua^1,2, Liu, Zeyu^1,2, Wang, Ru^1,2, wangru@hebut.edu.cn, Han, Shengxing^1,2, Zeng, Yao^1,2, Li, Yiken^1,2
Source:	Journal of Electronic Materials; Feb2025, Vol. 54 Issue 2, p910-922, 13p
Database:	Applied Science & Technology Source
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ISSN:	03615235
DOI:	10.1007/s11664-024-11629-1