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Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.

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Title: Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.
Authors: Chen, Xuhua1,2, Liu, Zeyu1,2, Wang, Ru1,2, wangru@hebut.edu.cn, Han, Shengxing1,2, Zeng, Yao1,2, Li, Yiken1,2
Source: Journal of Electronic Materials; Feb2025, Vol. 54 Issue 2, p910-922, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182077583
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Xuhua%22">Chen, Xuhua</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Zeyu%22">Liu, Zeyu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Ru%22">Wang, Ru</searchLink><relatesTo>1,2</relatesTo>, <i>wangru@hebut.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Han%2C+Shengxing%22">Han, Shengxing</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zeng%2C+Yao%22">Zeng, Yao</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Yiken%22">Li, Yiken</searchLink><relatesTo>1,2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Feb2025, Vol. 54 Issue 2, p910-922, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=182077583
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-024-11629-1
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 13
        StartPage: 910
    Titles:
      – TitleFull: Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Chen, Xuhua
      – PersonEntity:
          Name:
            NameFull: Liu, Zeyu
      – PersonEntity:
          Name:
            NameFull: Wang, Ru
      – PersonEntity:
          Name:
            NameFull: Han, Shengxing
      – PersonEntity:
          Name:
            NameFull: Zeng, Yao
      – PersonEntity:
          Name:
            NameFull: Li, Yiken
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 02
              Text: Feb2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 54
            – Type: issue
              Value: 2
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1