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Characterization of thermal fatigue properties of lead-free Sn–Cu–Al–Mg solder alloy produced by powder metallurgy method.

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Bibliographic Details
Title: Characterization of thermal fatigue properties of lead-free Sn–Cu–Al–Mg solder alloy produced by powder metallurgy method.
Authors: Serin, Nimet Selin1, Soy, Berke1, Keskin, Gorkem1, Arabaci, Aliye1, Emiroglu, Yasin2, Mutlu, Ilven1, imutlu@iuc.edu.tr
Source: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 2, p1-12, 12p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-025-14249-5