Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.
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| Title: | Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates. |
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| Authors: | Chen, Yin-Hsuan1,2, Chen, Chun-Hao3, chench@nycu.edu.tw, Syafei, Devi Indrawati2, Chen, Yen-Ting1,2, Chang, Che-Yuan2, Chuang, Tung-Han1 |
| Source: | Journal of Materials Science: Materials in Electronics; Feb2025, Vol. 36 Issue 6, p1-12, 12p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14451-5 |
