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Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.

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Title: Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.
Authors: Chen, Yin-Hsuan1,2, Chen, Chun-Hao3, chench@nycu.edu.tw, Syafei, Devi Indrawati2, Chen, Yen-Ting1,2, Chang, Che-Yuan2, Chuang, Tung-Han1
Source: Journal of Materials Science: Materials in Electronics; Feb2025, Vol. 36 Issue 6, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 183309830
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Feb2025, Vol. 36 Issue 6, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=183309830
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-14451-5
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.
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            NameFull: Chen, Yin-Hsuan
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            NameFull: Chen, Chun-Hao
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            NameFull: Syafei, Devi Indrawati
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            NameFull: Chen, Yen-Ting
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            NameFull: Chang, Che-Yuan
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            NameFull: Chuang, Tung-Han
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            – D: 21
              M: 02
              Text: Feb2025
              Type: published
              Y: 2025
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              Value: 36
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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