Effect of ligand bond structure on self‐healing properties of XNBR/CuCl2 at different temperatures.

Saved in:
Bibliographic Details
Title: Effect of ligand bond structure on self‐healing properties of XNBR/CuCl2 at different temperatures.
Authors: Zhang, Xinru1, Guo, Ao2, Li, Rui1, Li, Xiaoxiao1, Hou, Yanbing1, Zhang, Yandan3, Han, Jingjie1, hjj0812@163.com
Source: Polymer Engineering & Science; Mar2025, Vol. 65 Issue 3, p1327-1339, 13p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
Description
ISSN:00323888
DOI:10.1002/pen.27079