Impact of Structural Changes in the Chip Carrier on the Heat Dissipation Performance of Power Transistors.

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Bibliographic Details
Title: Impact of Structural Changes in the Chip Carrier on the Heat Dissipation Performance of Power Transistors.
Authors: Yan-Zuo Chang1, Kao-Wei Min2, Pin-Hsi Tsai3, Shao-Jun Luo2, Cheng-Fu Yang3,4, cfyang@nuk.edu.tw, Ho Sheng Chen5, 2118543475@qq.com
Source: Sensors & Materials; 2025, Vol. 37 Issue 3, Part 1, p911-920, 10p
Database: Applied Science & Technology Source
Description
ISSN:09144935
DOI:10.18494/SAM5578