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Impact of Structural Changes in the Chip Carrier on the Heat Dissipation Performance of Power Transistors.

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Title: Impact of Structural Changes in the Chip Carrier on the Heat Dissipation Performance of Power Transistors.
Authors: Yan-Zuo Chang1, Kao-Wei Min2, Pin-Hsi Tsai3, Shao-Jun Luo2, Cheng-Fu Yang3,4, cfyang@nuk.edu.tw, Ho Sheng Chen5, 2118543475@qq.com
Source: Sensors & Materials; 2025, Vol. 37 Issue 3, Part 1, p911-920, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 183883191
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Impact of Structural Changes in the Chip Carrier on the Heat Dissipation Performance of Power Transistors.
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  Data: <searchLink fieldCode="AU" term="%22Yan-Zuo+Chang%22">Yan-Zuo Chang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Kao-Wei+Min%22">Kao-Wei Min</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Pin-Hsi+Tsai%22">Pin-Hsi Tsai</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Shao-Jun+Luo%22">Shao-Jun Luo</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Cheng-Fu+Yang%22">Cheng-Fu Yang</searchLink><relatesTo>3,4</relatesTo>, <i>cfyang@nuk.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Ho+Sheng+Chen%22">Ho Sheng Chen</searchLink><relatesTo>5</relatesTo>, <i>2118543475@qq.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Sensors+%26+Materials%22">Sensors & Materials</searchLink>; 2025, Vol. 37 Issue 3, Part 1, p911-920, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=183883191
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        Value: 10.18494/SAM5578
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