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Effect of Negative Substrate Bias Voltage and Pressure on the Structure and Properties of Tungsten Films Deposited by Magnetron Sputtering Technique.

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Bibliographic Details
Title: Effect of Negative Substrate Bias Voltage and Pressure on the Structure and Properties of Tungsten Films Deposited by Magnetron Sputtering Technique.
Authors: Vassallo, Espedito1, espedito.vassallo@istp.cnr.it, Pedroni, Matteo1,2, Saleh, Miriam1,3, Minelli, Daniele1,4, Firpo, Giuseppe2,5, Miorin, Enrico3, Deambrosis, Silvia Maria3, Zin, Valentina3, Ripamonti, Dario3, Origo, Luca4,5
Source: Coatings (2079-6412); Mar2025, Vol. 15 Issue 3, p319, 18p
Database: Applied Science & Technology Source
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ISSN:20796412
DOI:10.3390/coatings15030319