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Electromigration behavior comparison between through silicon via and through dielectric via in 2.5D interposer.

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Title: Electromigration behavior comparison between through silicon via and through dielectric via in 2.5D interposer.
Authors: Wu, Fa1,2, Li, Hao2, Cui, Wei3, Liu, Guangyin1, Zhang, Lun2, Feng, Yang2, Yang, Saiyu1, Tang, Qin1, Wang, Pan2, Shen, Jun1, shenjun@cqu.edu.cn, Tang, Zhaohuan2, zhaohuan.tang@cumec.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 10, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184614513
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Electromigration behavior comparison between through silicon via and through dielectric via in 2.5D interposer.
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  Data: <searchLink fieldCode="AU" term="%22Wu%2C+Fa%22">Wu, Fa</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Hao%22">Li, Hao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Cui%2C+Wei%22">Cui, Wei</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Guangyin%22">Liu, Guangyin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Lun%22">Zhang, Lun</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Feng%2C+Yang%22">Feng, Yang</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Saiyu%22">Yang, Saiyu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tang%2C+Qin%22">Tang, Qin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Pan%22">Wang, Pan</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Shen%2C+Jun%22">Shen, Jun</searchLink><relatesTo>1</relatesTo>, <i>shenjun@cqu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Tang%2C+Zhaohuan%22">Tang, Zhaohuan</searchLink><relatesTo>2</relatesTo>, <i>zhaohuan.tang@cumec.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2025, Vol. 36 Issue 10, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184614513
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        Value: 10.1007/s10854-025-14662-w
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              Text: Apr2025
              Type: published
              Y: 2025
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