Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.
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| Title: | Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems. |
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| Authors: | Kang, Jiwan1, Sharma, Ashutosh1,2, Jung, Jae Pil1, jpjung@uos.ac.kr |
| Source: | Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-14, 14p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14658-6 |
