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Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.

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Title: Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.
Authors: Kang, Jiwan1, Sharma, Ashutosh1,2, Jung, Jae Pil1, jpjung@uos.ac.kr
Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-14, 14p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
An: 184627529
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2025, Vol. 36 Issue 12, p1-14, 14p
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-14658-6
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 1
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      – TitleFull: Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.
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            NameFull: Kang, Jiwan
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            NameFull: Sharma, Ashutosh
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            NameFull: Jung, Jae Pil
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            – D: 21
              M: 04
              Text: Apr2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 12
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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