Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process.
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| Title: | Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process. |
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| Authors: | Lai, Zelei1, Zou, Zhenyou2, Ye, Jinyu3, Lin, Yibin2, Zhou, Xiongtu2,3, xtzhou@fzu.edu.cn, Sun, Jie2,3, Guo, Tailiang2,3, Wu, Chaoxing2,3, nnnwcx@foxmail.com, Yan, Qun2,3, Sun, Lei4, Zhang, Yongai2,3, yongaizhang@fzu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-11, 11p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14764-5 |
