APA (7th ed.) Citation

Lai, Z., Zou, Z., Ye, J., Lin, Y., Zhou, X., Sun, J., . . . Zhang, Y. (2025). Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process. Journal of Materials Science: Materials in Electronics, 36(12), 1. https://doi.org/10.1007/s10854-025-14764-5

Chicago Style (17th ed.) Citation

Lai, Zelei, et al. "Fabrication of Uniform Submicron Metal Bump Arrays Based on Undercut Sacrificial Layer for Lift-off Process." Journal of Materials Science: Materials in Electronics 36, no. 12 (2025): 1. https://doi.org/10.1007/s10854-025-14764-5.

MLA (9th ed.) Citation

Lai, Zelei, et al. "Fabrication of Uniform Submicron Metal Bump Arrays Based on Undercut Sacrificial Layer for Lift-off Process." Journal of Materials Science: Materials in Electronics, vol. 36, no. 12, 2025, p. 1, https://doi.org/10.1007/s10854-025-14764-5.