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Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process.

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Title: Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process.
Authors: Lai, Zelei1, Zou, Zhenyou2, Ye, Jinyu3, Lin, Yibin2, Zhou, Xiongtu2,3, xtzhou@fzu.edu.cn, Sun, Jie2,3, Guo, Tailiang2,3, Wu, Chaoxing2,3, nnnwcx@foxmail.com, Yan, Qun2,3, Sun, Lei4, Zhang, Yongai2,3, yongaizhang@fzu.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-11, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184627534
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Lai%2C+Zelei%22">Lai, Zelei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zou%2C+Zhenyou%22">Zou, Zhenyou</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Ye%2C+Jinyu%22">Ye, Jinyu</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Yibin%22">Lin, Yibin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Xiongtu%22">Zhou, Xiongtu</searchLink><relatesTo>2,3</relatesTo>, <i>xtzhou@fzu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Sun%2C+Jie%22">Sun, Jie</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Tailiang%22">Guo, Tailiang</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Chaoxing%22">Wu, Chaoxing</searchLink><relatesTo>2,3</relatesTo>, <i>nnnwcx@foxmail.com</i><br /><searchLink fieldCode="AU" term="%22Yan%2C+Qun%22">Yan, Qun</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Lei%22">Sun, Lei</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yongai%22">Zhang, Yongai</searchLink><relatesTo>2,3</relatesTo>, <i>yongaizhang@fzu.edu.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2025, Vol. 36 Issue 12, p1-11, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184627534
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-14764-5
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 1
    Titles:
      – TitleFull: Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Lai, Zelei
      – PersonEntity:
          Name:
            NameFull: Zou, Zhenyou
      – PersonEntity:
          Name:
            NameFull: Ye, Jinyu
      – PersonEntity:
          Name:
            NameFull: Lin, Yibin
      – PersonEntity:
          Name:
            NameFull: Zhou, Xiongtu
      – PersonEntity:
          Name:
            NameFull: Sun, Jie
      – PersonEntity:
          Name:
            NameFull: Guo, Tailiang
      – PersonEntity:
          Name:
            NameFull: Wu, Chaoxing
      – PersonEntity:
          Name:
            NameFull: Yan, Qun
      – PersonEntity:
          Name:
            NameFull: Sun, Lei
      – PersonEntity:
          Name:
            NameFull: Zhang, Yongai
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 21
              M: 04
              Text: Apr2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1