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Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.

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Bibliographic Details
Title: Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.
Authors: Zhou, Meng-ran1, Sun, Wan-chang1, sunwanchang@tsinghua.org.cn, Liu, Er-yong1, Xiao, Yan2, Xu, Yi-fan1, Zhang, Bo1, Jia, Tian-ze1, Cai, Hui1, Zhang, Jing-li1
Source: Journal of Applied Electrochemistry; Jun2025, Vol. 55 Issue 6, p1615-1628, 14p
Database: Applied Science & Technology Source
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ISSN:0021891X
DOI:10.1007/s10800-024-02255-0