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Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.

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Title: Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.
Authors: Zhou, Meng-ran1, Sun, Wan-chang1, sunwanchang@tsinghua.org.cn, Liu, Er-yong1, Xiao, Yan2, Xu, Yi-fan1, Zhang, Bo1, Jia, Tian-ze1, Cai, Hui1, Zhang, Jing-li1
Source: Journal of Applied Electrochemistry; Jun2025, Vol. 55 Issue 6, p1615-1628, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184825872
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.
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  Data: <searchLink fieldCode="AU" term="%22Zhou%2C+Meng-ran%22">Zhou, Meng-ran</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Wan-chang%22">Sun, Wan-chang</searchLink><relatesTo>1</relatesTo>, <i>sunwanchang@tsinghua.org.cn</i><br /><searchLink fieldCode="AU" term="%22Liu%2C+Er-yong%22">Liu, Er-yong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xiao%2C+Yan%22">Xiao, Yan</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Yi-fan%22">Xu, Yi-fan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Bo%22">Zhang, Bo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Jia%2C+Tian-ze%22">Jia, Tian-ze</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Cai%2C+Hui%22">Cai, Hui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Jing-li%22">Zhang, Jing-li</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Applied+Electrochemistry%22">Journal of Applied Electrochemistry</searchLink>; Jun2025, Vol. 55 Issue 6, p1615-1628, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184825872
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10800-024-02255-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 14
        StartPage: 1615
    Titles:
      – TitleFull: Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices.
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            NameFull: Zhou, Meng-ran
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            NameFull: Sun, Wan-chang
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            NameFull: Liu, Er-yong
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            NameFull: Xiao, Yan
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            NameFull: Xu, Yi-fan
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            NameFull: Zhang, Bo
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            NameFull: Jia, Tian-ze
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            NameFull: Cai, Hui
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            NameFull: Zhang, Jing-li
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            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
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              Value: 0021891X
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              Value: 55
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              Value: 6
          Titles:
            – TitleFull: Journal of Applied Electrochemistry
              Type: main
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