Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.
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| Title: | Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy. |
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| Authors: | Lin, Wei-Ting1, Li, Kelvin2, kelvin-li@shenmao.com.tw, Lin, Kuo-Shu2, Wang, Chang-Meng2, Wu, Albert T.1, atwu@ncu.edu.tw |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2025, Vol. 77 Issue 6, p4215-4225, 11p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 10474838 |
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| DOI: | 10.1007/s11837-025-07269-3 |
