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Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.

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Title: Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.
Authors: Lin, Wei-Ting1, Li, Kelvin2, kelvin-li@shenmao.com.tw, Lin, Kuo-Shu2, Wang, Chang-Meng2, Wu, Albert T.1, atwu@ncu.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2025, Vol. 77 Issue 6, p4215-4225, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185281874
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=185281874
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11837-025-07269-3
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 11
        StartPage: 4215
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      – TitleFull: Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.
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          Name:
            NameFull: Lin, Wei-Ting
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          Name:
            NameFull: Li, Kelvin
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            NameFull: Lin, Kuo-Shu
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            NameFull: Wang, Chang-Meng
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            NameFull: Wu, Albert T.
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            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
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              Value: 10474838
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              Value: 77
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              Value: 6
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