Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding.
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| Title: | Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding. |
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| Authors: | Zhang, Yu1, Liu, Zheng2, lz155365966@126.com, He, Yucong1, Yang, Li1,2, linlideyu@126.com |
| Source: | Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 15, p1-12, 12p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14976-9 |
