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Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding.

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Title: Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding.
Authors: Zhang, Yu1, Liu, Zheng2, lz155365966@126.com, He, Yucong1, Yang, Li1,2, linlideyu@126.com
Source: Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 15, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185638721
AccessLevel: 2
PubType: Academic Journal
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  Data: Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2025, Vol. 36 Issue 15, p1-12, 12p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-14976-9
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: Effect of bonding time on the microstructure and shear property of Cu/InSnZnBi/Cu solder joint by transient liquid phase bonding.
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            NameFull: Zhang, Yu
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            NameFull: Liu, Zheng
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            NameFull: He, Yucong
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            – D: 21
              M: 05
              Text: May2025
              Type: published
              Y: 2025
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              Value: 36
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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