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Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.

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Bibliographic Details
Title: Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.
Authors: Lin, Yiling1, Xu, Ruisheng1, Qiao, Yuanyuan1, Zhao, Ning1, zhaoning@dlut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 14, p1-11, 11p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-025-14865-1