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Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.

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Title: Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.
Authors: Lin, Yiling1, Xu, Ruisheng1, Qiao, Yuanyuan1, Zhao, Ning1, zhaoning@dlut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 14, p1-11, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185675298
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PubType: Academic Journal
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  Data: Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Yiling%22">Lin, Yiling</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Ruisheng%22">Xu, Ruisheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Qiao%2C+Yuanyuan%22">Qiao, Yuanyuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Ning%22">Zhao, Ning</searchLink><relatesTo>1</relatesTo>, <i>zhaoning@dlut.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2025, Vol. 36 Issue 14, p1-11, 11p
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      – Type: doi
        Value: 10.1007/s10854-025-14865-1
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      – Code: eng
        Text: English
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        PageCount: 11
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      – TitleFull: Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints.
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            NameFull: Lin, Yiling
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            NameFull: Xu, Ruisheng
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            NameFull: Qiao, Yuanyuan
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            NameFull: Zhao, Ning
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            – D: 11
              M: 05
              Text: May2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 14
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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