Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C.
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| Title: | Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C. |
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| Authors: | Chen, Wenjing1, Chen, Bin2, Hu, Xiaowu2, huxiaowu@ncu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 13, p1-12, 12p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14858-0 |
