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Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C.

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Title: Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C.
Authors: Chen, Wenjing1, Chen, Bin2, Hu, Xiaowu2, huxiaowu@ncu.edu.cn
Source: Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 13, p1-12, 12p
Database: Applied Science & Technology Source
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An: 185707236
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PubType: Academic Journal
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  Data: Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2025, Vol. 36 Issue 13, p1-12, 12p
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      – Type: doi
        Value: 10.1007/s10854-025-14858-0
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C.
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            NameFull: Chen, Wenjing
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            NameFull: Chen, Bin
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            NameFull: Hu, Xiaowu
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            – D: 01
              M: 05
              Text: May2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 13
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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