Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)
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| Title: | Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025) |
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| Authors: | Chen, Ting1, Liou, Yi-Chin1, Hsiao, Hsien-Ming2, Yen, Yee-Wen1,3, ywyen@mail.ntust.edu.tw |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 16, p1-14, 14p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-15075-5 |
