APA (7th ed.) Citation

Chen, T., Liou, Y., Hsiao, H., & Yen, Y. (2025). Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025). Journal of Materials Science: Materials in Electronics, 36(16), 1. https://doi.org/10.1007/s10854-025-15075-5

Chicago Style (17th ed.) Citation

Chen, Ting, Yi-Chin Liou, Hsien-Ming Hsiao, and Yee-Wen Yen. "Liquid/solid Interfacial Reactions Between Lead-free Solders and Cu–Ni–Si–Mg Alloy (C7025)." Journal of Materials Science: Materials in Electronics 36, no. 16 (2025): 1. https://doi.org/10.1007/s10854-025-15075-5.

MLA (9th ed.) Citation

Chen, Ting, et al. "Liquid/solid Interfacial Reactions Between Lead-free Solders and Cu–Ni–Si–Mg Alloy (C7025)." Journal of Materials Science: Materials in Electronics, vol. 36, no. 16, 2025, p. 1, https://doi.org/10.1007/s10854-025-15075-5.