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Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)

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Title: Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)
Authors: Chen, Ting1, Liou, Yi-Chin1, Hsiao, Hsien-Ming2, Yen, Yee-Wen1,3, ywyen@mail.ntust.edu.tw
Source: Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 16, p1-14, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185881469
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)
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  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Ting%22">Chen, Ting</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liou%2C+Yi-Chin%22">Liou, Yi-Chin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hsiao%2C+Hsien-Ming%22">Hsiao, Hsien-Ming</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yen%2C+Yee-Wen%22">Yen, Yee-Wen</searchLink><relatesTo>1,3</relatesTo>, <i>ywyen@mail.ntust.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2025, Vol. 36 Issue 16, p1-14, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=185881469
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-15075-5
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 14
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      – TitleFull: Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)
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            NameFull: Chen, Ting
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            NameFull: Liou, Yi-Chin
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            NameFull: Hsiao, Hsien-Ming
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            NameFull: Yen, Yee-Wen
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            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 16
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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