Effect of nickel on the Cu–Sn based joint material.
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| Title: | Effect of nickel on the Cu–Sn based joint material. |
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| Authors: | Li, Hanbing1, Jiang, Hui1, Shen, Jun1, shenjun@cqu.edu.cn, Luo, D.2, Chen, Q.2 |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 18, p1-12, 12p |
| Database: | Applied Science & Technology Source |
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