Long-time stable copper paste with self-reducibility as a die-attach material for power electronics.
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| Title: | Long-time stable copper paste with self-reducibility as a die-attach material for power electronics. |
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| Authors: | Huang, Shijun1, Li, Mulan1, Chen, Zehao1, Yan, Longlong1, Liu, Jingwen1, Li, Cai-Fu1, licaifu@mail.sysu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Jul2025, Vol. 36 Issue 19, p1-14, 14p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-15249-1 |
