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Long-time stable copper paste with self-reducibility as a die-attach material for power electronics.

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Title: Long-time stable copper paste with self-reducibility as a die-attach material for power electronics.
Authors: Huang, Shijun1, Li, Mulan1, Chen, Zehao1, Yan, Longlong1, Liu, Jingwen1, Li, Cai-Fu1, licaifu@mail.sysu.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Jul2025, Vol. 36 Issue 19, p1-14, 14p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
An: 186439483
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PubType: Academic Journal
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  Data: <searchLink fieldCode="AU" term="%22Huang%2C+Shijun%22">Huang, Shijun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Mulan%22">Li, Mulan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Zehao%22">Chen, Zehao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yan%2C+Longlong%22">Yan, Longlong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Jingwen%22">Liu, Jingwen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Cai-Fu%22">Li, Cai-Fu</searchLink><relatesTo>1</relatesTo>, <i>licaifu@mail.sysu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jul2025, Vol. 36 Issue 19, p1-14, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186439483
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-15249-1
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      – Code: eng
        Text: English
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        PageCount: 14
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      – TitleFull: Long-time stable copper paste with self-reducibility as a die-attach material for power electronics.
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            NameFull: Huang, Shijun
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            NameFull: Li, Mulan
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            NameFull: Chen, Zehao
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            NameFull: Yan, Longlong
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            NameFull: Liu, Jingwen
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            NameFull: Li, Cai-Fu
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          Dates:
            – D: 01
              M: 07
              Text: Jul2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 19
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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