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Electrospun SiO2/polyimide materials based on the water‐soluble polyamiс acid salt PMDA‐ODA with an ultra‐low dielectric constant.

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Bibliographic Details
Title: Electrospun SiO2/polyimide materials based on the water‐soluble polyamiс acid salt PMDA‐ODA with an ultra‐low dielectric constant.
Authors: Kamalov, Almaz1,2, spb.kamalov@gmail.com, Kraft, Vadim1, Ivanova, Anna2, Ivanov, Alexey2, Vaganov, Gleb2, Popova, Elena2, Saprykina, Natalia2, Yudin, Vladimir2
Source: Polymer Engineering & Science; Jun2025, Vol. 65 Issue 6, p2922-2929, 8p
Database: Applied Science & Technology Source
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Description
ISSN:00323888
DOI:10.1002/pen.27188