Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials.
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| Title: | Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials. |
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| Authors: | Fardin, Sadib1,2, sadibf@umd.edu, Moresalein, Md. Jawarul1, moresaleinayon1998@gmail.com, Motalab, Mohammad1, abdulmotalab@me.buet.ac.bd, Faiyad, Abrar3, afaiyad@ucmerced.com, Paul, Ratul4, ratulxyz@gmail.com |
| Source: | Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6828-6846, 19p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-025-12048-6 |
