Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials.
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| Title: | Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials. |
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| Authors: | Fardin, Sadib1,2, sadibf@umd.edu, Moresalein, Md. Jawarul1, moresaleinayon1998@gmail.com, Motalab, Mohammad1, abdulmotalab@me.buet.ac.bd, Faiyad, Abrar3, afaiyad@ucmerced.com, Paul, Ratul4, ratulxyz@gmail.com |
| Source: | Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6828-6846, 19p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 186470121 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Fardin%2C+Sadib%22">Fardin, Sadib</searchLink><relatesTo>1,2</relatesTo>, <i>sadibf@umd.edu</i><br /><searchLink fieldCode="AU" term="%22Moresalein%2C+Md%2E+Jawarul%22">Moresalein, Md. Jawarul</searchLink><relatesTo>1</relatesTo>, <i>moresaleinayon1998@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Motalab%2C+Mohammad%22">Motalab, Mohammad</searchLink><relatesTo>1</relatesTo>, <i>abdulmotalab@me.buet.ac.bd</i><br /><searchLink fieldCode="AU" term="%22Faiyad%2C+Abrar%22">Faiyad, Abrar</searchLink><relatesTo>3</relatesTo>, <i>afaiyad@ucmerced.com</i><br /><searchLink fieldCode="AU" term="%22Paul%2C+Ratul%22">Paul, Ratul</searchLink><relatesTo>4</relatesTo>, <i>ratulxyz@gmail.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Aug2025, Vol. 54 Issue 8, p6828-6846, 19p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186470121 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-025-12048-6 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 19 StartPage: 6828 Titles: – TitleFull: Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Fardin, Sadib – PersonEntity: Name: NameFull: Moresalein, Md. Jawarul – PersonEntity: Name: NameFull: Motalab, Mohammad – PersonEntity: Name: NameFull: Faiyad, Abrar – PersonEntity: Name: NameFull: Paul, Ratul IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: Aug2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 54 – Type: issue Value: 8 Titles: – TitleFull: Journal of Electronic Materials Type: main |
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