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Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.

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Bibliographic Details
Title: Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.
Authors: Li, Mulan1, Huang, Shijun1, Ding, Zifeng1, Li, Cai-Fu1, licaifu@mail.sysu.edu.cn
Source: Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6054-6068, 15p
Database: Applied Science & Technology Source
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Description
ISSN:03615235
DOI:10.1007/s11664-025-12051-x