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Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.

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Title: Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.
Authors: Li, Mulan1, Huang, Shijun1, Ding, Zifeng1, Li, Cai-Fu1, licaifu@mail.sysu.edu.cn
Source: Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6054-6068, 15p
Database: Applied Science & Technology Source
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  Data: Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Mulan%22">Li, Mulan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Shijun%22">Huang, Shijun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Zifeng%22">Ding, Zifeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Cai-Fu%22">Li, Cai-Fu</searchLink><relatesTo>1</relatesTo>, <i>licaifu@mail.sysu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Aug2025, Vol. 54 Issue 8, p6054-6068, 15p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-025-12051-x
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      – Code: eng
        Text: English
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        PageCount: 15
        StartPage: 6054
    Titles:
      – TitleFull: Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.
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            NameFull: Li, Mulan
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            NameFull: Huang, Shijun
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            NameFull: Ding, Zifeng
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            NameFull: Li, Cai-Fu
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            – D: 01
              M: 08
              Text: Aug2025
              Type: published
              Y: 2025
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              Value: 54
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              Value: 8
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            – TitleFull: Journal of Electronic Materials
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