Effect of Ag content on microstructure and properties of Pb-16Sn-7.5Sb solder.

Saved in:
Bibliographic Details
Title: Effect of Ag content on microstructure and properties of Pb-16Sn-7.5Sb solder.
Authors: Zhang, Xiaodi1,2, Wang, Fan1,2, Wang, Richu1,2, wrc910103@163.com, Peng, Chaoqun1,2, Cai, Zhiyong1,2, Peng, Xiang1,2, Peng, Jian1,2
Source: Journal of Materials Science: Materials in Electronics; Jul2025, Vol. 36 Issue 21, p1-10, 10p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
Description
ISSN:09574522
DOI:10.1007/s10854-025-15315-8