Maier, C., Rachwalsky, P., Wittmann, A., Koch, K. P., & Fischer, G. (2025). Characterizing surface roughness evolution in copper conductors under mechanical strain using power spectral density analysis. Materialwissenschaft und Werkstoffechnik, 56(9), 1225. https://doi.org/10.1002/mawe.70029
Chicago Style (17th ed.) CitationMaier, C., P. Rachwalsky, A. Wittmann, K. P. Koch, and G. Fischer. "Characterizing Surface Roughness Evolution in Copper Conductors Under Mechanical Strain Using Power Spectral Density Analysis." Materialwissenschaft Und Werkstoffechnik 56, no. 9 (2025): 1225. https://doi.org/10.1002/mawe.70029.
MLA (9th ed.) CitationMaier, C., et al. "Characterizing Surface Roughness Evolution in Copper Conductors Under Mechanical Strain Using Power Spectral Density Analysis." Materialwissenschaft Und Werkstoffechnik, vol. 56, no. 9, 2025, p. 1225, https://doi.org/10.1002/mawe.70029.