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Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach.

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Title: Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach.
Authors: Back, Geumji1, Oh, Seungjun2, Lee, Dongho2, Kim, Taesung1,2, tkim@skku.edu
Source: Materials Science in Semiconductor Processing; Feb2026, Vol. 202, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 189183997
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach.
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  Data: <searchLink fieldCode="AU" term="%22Back%2C+Geumji%22">Back, Geumji</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Oh%2C+Seungjun%22">Oh, Seungjun</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Dongho%22">Lee, Dongho</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Kim%2C+Taesung%22">Kim, Taesung</searchLink><relatesTo>1,2</relatesTo>, <i>tkim@skku.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+Science+in+Semiconductor+Processing%22">Materials Science in Semiconductor Processing</searchLink>; Feb2026, Vol. 202, pN.PAG-N.PAG, 1p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=189183997
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.mssp.2025.110119
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: N.PAG
    Titles:
      – TitleFull: Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Back, Geumji
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            NameFull: Oh, Seungjun
      – PersonEntity:
          Name:
            NameFull: Lee, Dongho
      – PersonEntity:
          Name:
            NameFull: Kim, Taesung
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          Dates:
            – D: 01
              M: 02
              Text: Feb2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 13698001
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            – Type: volume
              Value: 202
          Titles:
            – TitleFull: Materials Science in Semiconductor Processing
              Type: main
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