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Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics.

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Bibliographic Details
Title:	Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics.
Authors:	Wang, Xiuqi¹, Lu, Dashi¹, Luo, Zikang¹, Lian, Zheng¹, Li, Yifan¹, Pan, Hao², Miao, Xuan¹, Xin, Meiling³, Xu, Jie³, Song, Linlin⁴, Li, Mingyu¹, Ji, Hongjun¹, jhj7005@hit.edu.cn
Source:	Advanced Materials Technologies; 11/19/2025, Vol. 10 Issue 22, p1-16, 16p
Database:	Applied Science & Technology Source

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