Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion.
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| Title: | Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion. |
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| Authors: | Wu, Hong-Yi1, Fang, Yi-Ying1, Chen, Yu-Lin1, Lu, Jung-Fu1, Lu, Ming-Yen1, Chang, Shou-Yi1, Keng, Pei Yuin1, keng.py@mx.nthu.edu.tw |
| Source: | NPG Asia Materials; 11/29/2025, Vol. 17 Issue 1, p1-18, 18p |
| Database: | Applied Science & Technology Source |
| ISSN: | 18844049 |
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| DOI: | 10.1038/s41427-025-00627-2 |
