APA (7th ed.) Citation

Wu, H., Fang, Y., Chen, Y., Lu, J., Lu, M., Chang, S., & Keng, P. Y. (2025). Molecularly tailored SAMs for Ru interconnects: High-temperature stability, suppressed metal diffusion, and enhanced adhesion. NPG Asia Materials, 17(1), 1. https://doi.org/10.1038/s41427-025-00627-2

Chicago Style (17th ed.) Citation

Wu, Hong-Yi, Yi-Ying Fang, Yu-Lin Chen, Jung-Fu Lu, Ming-Yen Lu, Shou-Yi Chang, and Pei Yuin Keng. "Molecularly Tailored SAMs for Ru Interconnects: High-temperature Stability, Suppressed Metal Diffusion, and Enhanced Adhesion." NPG Asia Materials 17, no. 1 (2025): 1. https://doi.org/10.1038/s41427-025-00627-2.

MLA (9th ed.) Citation

Wu, Hong-Yi, et al. "Molecularly Tailored SAMs for Ru Interconnects: High-temperature Stability, Suppressed Metal Diffusion, and Enhanced Adhesion." NPG Asia Materials, vol. 17, no. 1, 2025, p. 1, https://doi.org/10.1038/s41427-025-00627-2.