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Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion.

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Title: Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion.
Authors: Wu, Hong-Yi1, Fang, Yi-Ying1, Chen, Yu-Lin1, Lu, Jung-Fu1, Lu, Ming-Yen1, Chang, Shou-Yi1, Keng, Pei Yuin1, keng.py@mx.nthu.edu.tw
Source: NPG Asia Materials; 11/29/2025, Vol. 17 Issue 1, p1-18, 18p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 189799348
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion.
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  Data: <searchLink fieldCode="AU" term="%22Wu%2C+Hong-Yi%22">Wu, Hong-Yi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fang%2C+Yi-Ying%22">Fang, Yi-Ying</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yu-Lin%22">Chen, Yu-Lin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Jung-Fu%22">Lu, Jung-Fu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Ming-Yen%22">Lu, Ming-Yen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chang%2C+Shou-Yi%22">Chang, Shou-Yi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Keng%2C+Pei+Yuin%22">Keng, Pei Yuin</searchLink><relatesTo>1</relatesTo>, <i>keng.py@mx.nthu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22NPG+Asia+Materials%22">NPG Asia Materials</searchLink>; 11/29/2025, Vol. 17 Issue 1, p1-18, 18p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=189799348
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      – Type: doi
        Value: 10.1038/s41427-025-00627-2
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        Text: English
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      – TitleFull: Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion.
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              Text: 11/29/2025
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