Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding.
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| Title: | Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding. |
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| Authors: | Ren, Xiaosong1, Zhao, Yao2, Yan, Zhengyu3, Shi, Yanli4, Yuan, Zhiliang3, Lin, Linhan2, Sun, Hong‐Bo2, Huang, Yidong1,3, Zhang, Wei1,3, zwei@tsinghua.edu.cn |
| Source: | Laser & Photonics Reviews; 1/8/2026, Vol. 20 Issue 1, p1-8, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 18638880 |
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| DOI: | 10.1002/lpor.202500826 |
